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SEMICONDUCTOR

Kobelco LEO Division

LTA (for FPD) / LTA (for Wafer)

Lifetime Measurement System

  • Comply with JEIDA Standard (53-1997)
  • Multi-layer wafer lifetime
  • High-sensitivity, high speed
  • Iron concentration measurement
  • Ample measuring/indicating modes
  • OX film/silicon interface evaluation
  • Evaluation of p-Si and Oxide layer of LCD
  • Evaluation of SiC

LEP

Edge Profile Monitor

  • Complying with Method-B of the Standard in measuring edge shape (ASTM-F928-93)
  • High precision
  • Various measurement items
  • Various models

SBW / LBW

Bow/Warp Measurement System

  • High-speed, high-precision
  • Free selection of measurement plane and reference plane
  • Various data display
  • Multiple measurement items (Bow, Warp, Thickness, TTV)
  • Measurements in various processes
  • Compact, reasonable price
  • Multi-Port (LBW)
  • LBW + Magic Mirror System
  • Fine concave/convex visualization
  • Wide detection coverage
  • Magnification selection

LER

Egde roll off Measurement System

  • Simultaneous measurement of the front and back sides
  • Measurement of both mirror finished surface and rough surface
  • High precision, High repeatability
  • Various data display (2-D / 3-D profiles)

LRW

Wafer Sorter

  • Order made
  • Various sensors
  • Unrestricted construction
  • User friendly software

EPM

Bonding Evaluation / Edge Defect Inspection System

  • Bonding Evaluation Outline
  • Various Edge Shape
  • Notch Deviation